Product Core Brief
- Model: 5441-693
- Brand: WOODWARD
- Series: MicroNet TMR discrete digital I/O personality module family
- Core Function: Capture 24 dry contact status signals and drive 12 isolated Form-C relay outputs for turbine trip logic, breaker auxiliary feedback, and valve limit switch monitoring inside MicroNet TMR fault-tolerant racks.
- Product Type: Single-slot hot-swappable MicroNet TMR chassis discrete I/O card (through-hole PCB construction)
- Key Specs: 24 digital inputs | 12 isolated Form-C relay outputs (10 A @ 28 VDC) | 500 V field-to-backplane isolation | Native RTN shared I/O bus compatibility ⚠️ EOL — limited surplus stock remaining
Product Introduction
The WOODWARD 5441-693 plugs into the 5453-279 12-slot MicroNet TMR main chassis to handle all binary plant field signals for critical steam and gas turbine control systems. It does not execute control logic independently and requires paired TMR5200 CPU boards to process channel data over the RTN backplane bus.This unit differs from surface-mount high-density I/O cards via full through-hole PCB assembly, engineered to resist continuous turbine hall vibration. OEM field logging records a 56,000 hour MTBF under steady 50 °C cabinet runtime, 8% higher than compact surface-mount discrete modules.
Key Technical Specifications
| Parameter | Value |
|---|---|
| Compatible Chassis | 5453-279 MicroNet TMR 12-slot main control chassis; only fits standard TMR I/O slots |
| Digital Input Count | 24 sinking/sourcing dry contact inputs, 24 VDC internal wetting supply |
| Relay Output Count | 12 independent Form-C isolated relay channels |
| Relay Contact Rating | 10 A resistive at 28 VDC per channel; inductive loads require external arc suppression |
| Galvanic Isolation Rating | 500 Vrms opto-isolation between all field discrete circuits and TMR backplane logic |
| Hot Swap Compliance | MicroNet TMR certified hot-swap; chassis RTN bus remains active during card exchange |
| Backplane Communication | MicroNet RTN shared I/O bus, synchronized triple modular data sampling |
| Module Operating Supply | 5 V DC chassis backplane logic feed; 380 mA typical steady-state draw |
| Mechanical Dimensions | 300 mm L × 50 mm W × 150 mm D standard MicroNet personality card form factor |
| Net Unit Weight | 0.8 kg |
| Continuous Operating Ambient Temp | -20 °C to +60 °C full rated channel performance; linear derate above 60 °C |
| Storage Temperature Range | -40 °C to +85 °C, 5–95 % RH non-condensing |
| PCB Construction | Full through-hole component layout, vibration hardened for turbine cabinet environments |
| Integrated Protection Circuits | Input wetting circuit overcurrent fuses, backplane reverse polarity lockout, relay coil transient suppression diodes |
| Certifications | UL, CE, ATEX Zone 2, EN61000 Class A industrial EMC filtering |
Quality Control Process (Engineer’s Perspective)
- Incoming Verification: Cross-reference serial numbers against Woodward OEM trace databases; inspect front channel status LEDs for dead pixels, gold rack edge connectors for oxidation, through-hole relay driver solder joints for microcracks. Photograph the slot edge pinout for turbine control cabinet wiring reference.
- Live Functional Test: Seat the unit into a populated 5453-279 TMR chassis paired with dry contact switch simulators and relay load resistors; run a continuous 24-hour cyclic open/close test across all 24 inputs and 12 relay outputs. Log backplane bus voltage stability with a Fluke 115 digital multimeter for the full test duration.
- Electrical Parameter Test: Perform a 500 V Megger insulation resistance test between each discrete field circuit and module ground; pass threshold set at >10 MΩ. Verify relay contacts maintain rated 10 A capacity without contact degradation over 1 million switch cycles of accelerated testing.
- Firmware Verification: Read and record factory discrete I/O module firmware revision via Woodward MicroNet Service Tool software; document default input wetting enable register settings for customer turbine site reference.
- Final QC & Packaging: Wipe gold edge connectors to remove surface oxidation; seal the unit inside an anti-static foam bag, affix a dated QC Pass label listing all completed channel continuity and isolation test metrics before rigid shock-resistant carton packing.
Replacement Pitfall Guide
❗ Surface-Mount High-Density Module Mismatch Risk: Compact surface-mount MicroNet discrete I/O cards cannot replace this through-hole 5441-693 unit. High-density variants lack vibration resistance and use incompatible RTN bus timing registers, triggering continuous TMR data mismatch faults during turbine load transients. Confirm through-hole part number before rack extraction.❗ Partial Chassis Slot Insertion Risk: Uneven seating creates high-resistance edge contact points that drop discrete channel state data and generate unplanned turbine trip interlock misfires. Push the card fully into the slot and engage both front locking latches flush against the chassis faceplate.❗ Field Contact Cable Shield Ground Misconfiguration Risk: Unshielded discrete wiring run parallel to high-current generator excitation cabling injects EMI noise that creates false contact open/closed alarms. Use factory twisted-pair shielded discrete assemblies, terminate shield ground at only the main TMR cabinet terminal block end.❗ TMR Chassis Power Headroom Miscalculation Risk: A 5453-279 chassis loaded with eight of these discrete modules draws 3.04 A total from the VM310 24 V auxiliary supply. Calculate total load with a mandatory 20% power margin to avoid voltage sag during full relay actuation cycles on turbine startup.❗ Uncontrolled ESD Damage Risk: Dry turbine control room air creates static charge buildup. Touch a grounded anti-static mat for three full seconds before handling the gold edge connector; ungrounded contact destroys low-tolerance RTN bus opto-isolator circuits.Keep these in mind and you’ll cut 90% of rework time.
Compatibility Matrix & Benchmarks
Compatibility Matrix
- Surface-mount high-density MicroNet discrete I/O module → 5441-693 : Incompatible — mismatched RTN bus timing and vibration-resistant PCB architecture break TMR triple data synchronization
- 5453-279 12-slot MicroNet TMR main chassis → 5441-693 : Direct — factory slot pinout natively matches chassis 5 V logic supply and RTN shared I/O bus routing
- TMR5200 triple modular redundant CPU board → 5441-693 : Direct — CPU samples all 36 discrete channels synchronously over the chassis RTN backplane
- VM310 24 V cabinet auxiliary power supply → 5441-693 : Direct — regulated 24 V output feeds internal input wetting circuits via chassis terminal blocks
- WOODWARD 9907-1290 turbine speed governor → 5441-693 : Direct — governor overspeed dry fault contacts wire directly to the module’s 24 V digital input channels
- CML40.2-SP-330-NA-NNNN-NW Rexroth SERCOS motion PLC → 5441-693 : Needs Adaptation — wire module trip relay dry outputs to PLC digital inputs, map breaker/valve status registers via Modbus RTU gateway bridging the MicroNet RTN bus
