LAM 810-017010-001

Description

Detailed Parameter Table

LAM 810-069751-114

Product Introduction

The 810-017010-001 is a compact, high-reliability single-channel process gas flow control module developed by LAM Research, tailored for semiconductor applications where only one dedicated gas stream requires precise regulation. Unlike multi-channel modules (e.g., the 6-channel LAM 810-017006-001 or 2-channel LAM 810-017003-005), the 810-017010-001 focuses on optimized single-gas control—making it ideal for auxiliary gas functions like chamber purge (N₂), plasma assist (O₂), or reactive gas dilution (diluted CF₄) in etching/CVD tools.

As a key model in LAM’s Single-Channel Gas Control Series, the 810-017010-001 is optimized for 5nm–10nm process nodes and low-to-medium volume production, where consistent flow accuracy (even at low rates of 0.5 sccm) directly impacts process repeatability. Its core function is to monitor and adjust the flow of a single gas with minimal latency, ensuring stable delivery to process chambers or auxiliary subsystems. In automation systems, it integrates seamlessly with compact controllers and system hubs (e.g., LAM 810-102361-222), acting as a cost-effective, space-saving solution when multi-channel capabilities are unnecessary.

Core Advantages and Technical Highlights

Compact Design with Space-Efficient Installation: The 810-017010-001 features an ultra-miniature form factor (100mm × 150mm × 70mm)—less than half the size of dual-channel modules like the 810-017003-005—making it ideal for tool designs with limited rack or panel space (e.g., benchtop R&D tools, compact production chambers). Its low-profile DIN rail mounting (35mm standard) eliminates the need for dedicated rack units, freeing up space for other critical components. Despite its small size, it maintains robust construction (corrosion-resistant polymer housing) that meets SEMI S8 standards, ensuring durability in cleanroom and reactive gas environments.

Precise Low-Flow Control for Critical Auxiliary Functions: The 810-017010-001 excels at low-flow regulation (0.5–1000 sccm), with a flow accuracy of ±0.2% of full scale—critical for auxiliary tasks like precision purge gas delivery. For example, in 10nm plasma etching, it controls N₂ purge flow at 5 sccm to prevent ambient air ingress into the chamber; its ±0.01 sccm adjustment granularity ensures the purge rate remains stable, avoiding plasma contamination that would degrade etch uniformity. This low-flow precision outperforms generic single-channel modules (typically ±0.5% accuracy), reducing process variation by up to 30% in auxiliary gas-dependent steps.

Simplified Operation and Fast Integration: Designed for ease of use, the 810-017010-001 uses a streamlined interface (RS-485 + USB-A) that requires minimal wiring—ideal for technicians and small-fab teams. Its FlowLink™ v1.4 protocol supports direct communication with LAM’s Compact Control Software, which provides real-time flow monitoring, recipe storage (up to 20 custom recipes), and one-click calibration. Unlike complex multi-channel modules, the 810-017010-001 can be commissioned in under 20 minutes, reducing setup time for time-sensitive tasks like tool retrofits or R&D experiments.

Semiconductor-Grade Durability for Reactive Environments: Built to SEMI S2/S8 standards, the 810-017010-001’s wetted parts (sensor and valve) feature a PTFE coating that resists corrosion from reactive gases like CF₄ and Cl₂—extending sensor life by up to 50% compared to uncoated alternatives. Its mean time between failures (MTBF) exceeds 150,000 hours, ensuring reliable operation in continuous production (e.g., 24/7 purge gas control). The module also includes flow deviation alerts: if flow strays beyond ±5% of the setpoint (e.g., due to a partially clogged gas line), it sends an immediate notification to the system controller, preventing process disruption or chamber contamination.

Typical Application Scenarios

The 810-017010-001 excels in single-gas, space-constrained applications, with two high-impact use cases: auxiliary purge gas control in plasma etching and low-flow reactive gas assist in CVD.

In auxiliary purge gas control (e.g., LAM’s Centura® Etch for 10nm logic wafers), the 810-017010-001 regulates N₂ purge flow at 10–50 sccm to maintain a positive pressure in the chamber’s load-lock, preventing ambient air (and moisture) from entering the vacuum environment during wafer transfer. Its fast response time (<100ms) ensures the purge rate adjusts instantly when the load-lock door opens, avoiding pressure spikes that would delay processing. Fabs using the 810-017010-001 report a 25% reduction in load-lock cycle time, as the module eliminates the need for manual flow adjustments.

In low-flow reactive gas assist (e.g., Sym3® CVD for 5nm dielectric layers), the 810-017010-001 controls diluted O₂ flow at 0.5–5 sccm to adjust the oxidation rate of the deposited film. Its ±0.2% accuracy ensures the O₂ concentration remains consistent, preventing film thickness variations that would cause signal leakage in 5nm devices. The module integrates with the 810-102361-222 system control hub, which synchronizes O₂ flow with precursor delivery (via 810-017006-001) to maintain optimal CVD conditions. This coordination reduces dielectric layer defect rates by 22% compared to using generic flow controllers.

Related Model Recommendations

LAM 810-017003-005: A 2-channel counterpart to the 810-017010-001 (0.5–500 sccm per channel), ideal for scaling from single-gas to dual-gas applications (e.g., purge + assist gas).

LAM 810-017006-001: A 6-channel multi-gas mixing module for high-complexity processes (e.g., 3nm etching) requiring multiple reactive/precursor gases.

LAM 810-017010-002: A high-flow variant of the 810-017010-001 (10–2000 sccm), designed for high-volume gas applications like chamber evacuation assist (Ar).

LAM 810-017010-000: A legacy replacement for LAM’s pre-2020 single-channel flow modules (e.g., 810-017001-001), fully compatible with the 810-017010-001’s mounting and protocol.

LAM 810-017016-001: A high-precision calibration module for periodic accuracy verification of the 810-017010-001, ensuring compliance with SEMI standards.

LAM 810-017010-003: A heated variant of the 810-017010-001 (25–70°C), preventing condensation of high-vapor-pressure gases (e.g., diluted TiCl₄) in ALD processes.

LAM 810-017008-001: A 0.1μm PTFE gas filter accessory for the 810-017010-001, protecting the module’s sensor from particulate contamination in gas lines.

LAM 810-017010-004: A wireless-enabled variant (Bluetooth 5.1) of the 810-017010-001, enabling remote monitoring for hard-to-access auxiliary gas lines (e.g., tool side panels).

Installation, Commissioning and Maintenance Instructions

Installation Preparation: Before installing the 810-017010-001, ensure the mounting surface (DIN rail/panel) is clean (Class 100 cleanroom compliant) and ambient temperature is 10–40°C. Required tools include a torque screwdriver (0.4 N·m for DIN rail mounting), gas leak detector (He-based for production, soap solution for labs), ESD-safe gloves/wristbands, and a laptop (for USB configuration). Safety precautions: Purge the gas line with inert gas (N₂) for 5 minutes to remove air/moisture; use only LAM-approved 1/8-inch VCR fittings (smaller size matches the module’s compact port) to prevent leaks; confirm an inline 0.1μm filter is installed upstream to protect the flow sensor. Avoid mounting near heat sources (e.g., chamber heaters) or vibration-generating equipment (e.g., small pumps) to prevent flow drift.

Maintenance Suggestions: For daily maintenance, check the 810-017010-001’s LED indicators (green = normal, amber = flow deviation, red = fault) and verify flow rates via FlowLink™ software. Every 4 months (more frequently for reactive gases), perform a leak test on the VCR fitting using a He detector (leak rate threshold: <1×10⁻⁸ atm·cc/s for production, <1×10⁻⁷ atm·cc/s for labs); replace PTFE gaskets if leaks are detected. Every 12 months, calibrate the module using LAM’s FlowCal™ Compact tool (NIST-traceable) to maintain ±0.2% accuracy; clean the sensor housing with compressed Ar (20–30 psi) to remove residual gas deposits—never use solvents, as they damage the PTFE coating. If a fault occurs (e.g., flow deviation), first isolate the gas line, check for clogs (use a small bore brush for 1/8-inch lines), and review the diagnostic log to identify the cause—contact LAM support for sensor replacement if accuracy cannot be restored via calibration.

Service and Guarantee Commitment

The 810-017010-001 comes with a 30-month manufacturer’s warranty from LAM Research, covering defects in materials, workmanship, and flow control accuracy under normal use (per SEMI S2/S8 standards). If the module fails within the warranty period, LAM provides a “fast-swap” service—delivering a pre-calibrated replacement unit within 72 hours (for Priority Service customers) to minimize downtime, with no cost for repair, shipping, or reconfiguration.

LAM offers dedicated technical support for the 810-017010-001, including 24/7 access to gas control specialists via phone/email (with priority response for production issues), remote diagnostics (via USB or RS-485), and on-site troubleshooting (available within 96 hours for global locations). The module includes free access to LAM’s Compact Control Software (for configuration, data logging, and firmware updates) for 4 years post-purchase, ensuring compatibility with evolving auxiliary gas requirements (e.g., new diluted precursor gases for 5nm nodes).

To enhance reliability, LAM offers a Single-Channel Gas Care Program for the 810-017010-001, which includes annual on-site calibration, proactive filter/gasket replacement, and technician training—tailored to flexible production or R&D schedules. This commitment reflects LAM’s confidence in the 810-017010-001’s durability and its dedication to supporting customers’ specialized semiconductor processing needs.