GE IS215UCVFH2A | Mark VI / Mark VIe UCV Controller In Stock

  • Model:​ IS215UCVFH2A
  • Brand:​ GE (General Electric)
  • Series:​ UCV (Universal Control and Communication – VMEbus)
  • Core Function:​ Serves as the primary VME bus controller, CPU, and central processor for Mark VI / Mark VIe turbine control systems.
  • Product Type:​ VME Controller / CPU Board (Dual-Slot)
  • Key Specs:​ 850 MHz Intel Pentium Processor | 128 MB DRAM | Dual Ethernet & SVGA
  • Condition:​ Refurbished / Tested
In Stock
Manufacturer:
Part number: IS215UCVFH2A
Our extensive catalogue, including : IS215UCVFH2A , is available now for dispatch to the worldwide. Brand:
The listed price is not final; the actual selling price is negotiable based on current market conditions.

Description

Product Introduction

The GE IS215UCVFH2A is a high-performance, dual-slot VME bus controller board engineered for GE’s Speedtronic Mark VI and Mark VIe turbine control systems. It acts as the brain of the control architecture, executing complex control algorithms, sequence logic, and real-time data processing for gas, steam, and wind turbines.

Equipped with an 850 MHz Intel Pentium processor and 128 MB of DRAM, this module delivers the computational power required for demanding industrial automation tasks. Housed in a dual-slot VME 6U form factor, it features a rich array of front-panel I/O, including dual Ethernet ports for high-speed communication, serial ports for initial setup, and legacy ports (USB, SVGA) for direct diagnostics and local engineering access. A quick tip from the bench:While highly reliable, third-party documentation for this specific revision can sometimes confuse it with Mark V I/O boards (like the TCQA); always verify the printed part number on the board’s faceplate before installation. With proper care, these units reliably deliver 15+ years of service in harsh industrial environments, though the onboard lithium battery will require periodic replacement to maintain the real-time clock (RTC).

Key Technical Specifications

Parameter Value
Processor 850 MHz Intel Pentium / 300 MHz Intel Celeron
Memory (DRAM / Flash) 128 MB DRAM / 16 MB or 32 MB Flash
Communication Interfaces 2 x Ethernet (10/100BaseTX), 2 x Serial RS-232C, 1 x USB, 1 x SVGA
Supported Protocols TCP/IP, EGD, Modbus, SRTP
Operating System QNX RTOS or VxWorks
Input Voltage 24 V DC (Nominal, powered via VME backplane)
Operating Temperature 0°C to +60°C (Typical), -30°C to +65°C (Extended)
Storage Temperature -40°C to +85°C
Humidity Tolerance 5% to 95% Non-condensing
Form Factor VMEbus 6U (Dual-Slot Width)
Mounting Style VME Rack Mount (Requires two consecutive slots)
Dimensions (Approx.) 340 mm × 160 mm × 20 mm
Weight (Approx.) 0.91 kg
Power Consumption (Max) 25 W
IS215UCVFH2A

IS215UCVFH2A

Quality Control Process

  1. Incoming Verification:​ Cross-reference serial numbers against GE manufacturing databases. Perform anti-counterfeit inspections on the Intel BGA processor and surrounding ICs. Visually inspect the VMEbus edge connector and front-panel ports (RJ-45, DB9, USB, SVGA) for physical wear or bent pins under 10x magnification.
  2. Live Functional Test:​ Mount the board into a Mark VI/Mark VIe compatible VME test chassis. Run diagnostic software (e.g., ToolboxST) to verify CPU performance, memory integrity, and data packet transmission via both Ethernet and COM ports over a rigorous 24-hour stress test.
  3. Electrical Parameter Test:​ Monitor voltage rails (+5V, +12V, -12V) under load conditions. Verify the 24V DC input stability. Test the onboard battery’s charging circuit and validate memory retention capabilities using specialized equipment.
  4. Firmware Verification:​ Read and document the current firmware/build version. Photograph all DIP switch and jumper configurations (e.g., bus addressing, reset configurations E8/E10) for the customer’s archival records.
  5. Final QC & Packaging:​ Clean the PCB and front panel with electronic-grade solvents. Wrap securely in anti-static foam with a desiccant pack to prevent moisture damage during transit. Affix a QC Passed sticker dated by the lead technician.

Replacement Pitfall Guide

Identity Check (Critical):​ Market documentation for the is frequently conflated with Mark V TCQA analog I/O boards or other 16-channel relay modules. Before installing, ensure the physical board matches the UCV controller architecture (large processor, multiple communication ports). If it looks like an I/O terminal board, do not install it in a CPU slot.

Non-Hot-Swappable:​ The is not​ hot-swappable. You must perform a controlled system shutdown and power down the VME rack before removing or inserting this module to prevent file system corruption or hardware damage.

Dual-Slot Clearance:​ This module occupies two consecutive slots in the VME chassis. Ensure your rack has the physical space and that the backplane connectors are clean and undamaged before installation.

Battery Safety:​ The module contains a lithium battery to retain the RTC and NVRAM. Avoid short-circuiting the battery terminals during handling. Replace the battery immediately if a “Low Battery” fault is logged in the diagnostics.

ESD Damage:​ The integrated circuits, especially the BGA processor, are highly sensitive to electrostatic discharge. Always use a grounded anti-static wrist strap and mat during installation.

Keep these in mind and you’ll cut 90% of rework time.

IS215UCVFH2A

IS215UCVFH2A

Compatibility Matrix & Benchmarks

  • IS215UCVEH2A → : Direct — Drop-in replacement with an upgraded processor (850MHz) and expanded front-panel I/O connectivity.
  • IS215UCVEM06A → : Direct / Equivalent — Comparable performance and dual-slot footprint; suitable for cross-system interchangeability within Mark VI/Vie architectures.
  • → IS215UCVEM09B : Needs Adaptation — The ‘M09B’ features a multi-core processor and dual Gigabit Ethernet but may require a system firmware upgrade to recognize the updated hardware stepping.
  • → IS215UCCAM03A : Incompatible — Different form factor (VME vs CPCI) and bus architecture.
  • Processor Performance: 850 MIPS (Million Instructions Per Second)
  • Data Throughput: 100 Mbps (Fast Ethernet communication, typical industrial load)