Description
Hard-Numbers: Technical Specifications
- Slot Count: 5 slots (universal—CPU can be installed in any slot)
- Baseplate Type: CPU Baseplate (mid-depth version)
- Voltage Rating: 115/230 VAC (50/60 Hz) or 24 VDC power supply input
- Current Capacity: Supports IC693PWRxxx series power supplies (up to 10 amps with IC690PWR124)
- Isolation: 1500 VAC isolation between logic and field circuits
- Backplane Power Bus: 5 VDC logic power, 24 VDC field power distribution
- Mounting: DIN rail or panel mount (grounded metal construction)
- Dimensions: Approx. 220 mm × 132 mm × 110 mm (mid-depth design)
- Weight: Approximately 1.6 kg (3.5 lbs)
- Operating Temperature: 0°C to 60°C (32°F to 140°F)
- Humidity: 5% to 95% non-condensing
- Connector Type: Edge connector for all Series 90-30 module types
- Power Supply Compatibility: IC693PWRxxx series power supplies (AC or DC input)
- CPU Compatibility: All Series 90-30 CPUs (IC693CPU3xx series)
- Expansion Capability: Supports up to 7 remote baseplates (CPUs 350-364) or 4 baseplates (CPUs 331-341)
- Maximum Expansion Distance: 213 meters (700 feet) to last remote baseplate
- Grounding: Integral grounding studs for proper chassis grounding
- Depth Category: Mid-depth (between standard IC693CHS397 and extended IC693CHS397L)
GE IC693CHS391
The Real-World Problem It Solves
Standard 5-slot baseplates often come in two extremes: the compact 98mm depth that fits anywhere but lacks clearance for high-profile modules, and the extended 123mm depth that accommodates everything but requires deeper cabinets. The IC693CHS397M occupies a sweet spot with its mid-depth design—around 110mm—providing enough clearance for most high-profile modules while still fitting into moderately deep cabinets. It’s the middle-ground solution when you need more space than a standard baseplate provides but don’t have the cabinet depth for the extended version.
Where you’ll typically find it:
- Compact controller racks: Small control systems where 5 slots provide enough CPU and I/O capacity without requiring larger 10-slot chassis
- Remote I/O stations: Distributed control nodes where space is limited but remote expansion from a main CPU is required
- Mid-depth cabinet installations: Control enclosures with moderate depth where extended baseplates won’t fit but standard depth leaves insufficient clearance
Bottom line: The IC693CHS397M offers a balanced mid-depth 5-slot solution—enough clearance for high-profile modules while maintaining a compact footprint that fits in cabinets too shallow for extended depth baseplates.
Hardware Architecture & Under-the-Hood Logic
The IC693CHS397M follows the same fundamental architecture as other Series 90-30 baseplates but with a chassis depth that falls between the standard 98mm and extended 123mm versions. The electrical characteristics, slot configuration, and expansion capabilities remain identical to other 5-slot baseplates—the only practical difference is the physical depth that determines module clearance and cabinet fitment.
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Mid-Depth Chassis DesignThe metal chassis is machined to a depth of approximately 110mm, roughly 12mm deeper than the standard IC693CHS397 and 13mm shallower than the extended IC693CHS397L. This intermediate depth provides:
- Clearance for most high-profile modules with heat sinks or terminal blocks
- Cabinet fitment in enclosures too shallow for extended depth units
- Improved natural convection around modules compared to standard depth versionsThe mounting hole patterns and DIN rail compatibility remain identical to standard and extended versions.
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Universal Slot ConfigurationAll 5 slots are electrically identical with the same edge connector pinout. The CPU can be installed in any slot—the backplane automatically detects CPU location and routes address/data buses accordingly. This flexibility allows optimal CPU placement based on cable routing, thermal management, or maintenance access needs.
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I/O Bus Transmitter IntegrationLike all Series 90-30 baseplates, the IC693CHS397M includes integral I/O bus transmitter circuitry:
- Supports remote expansion via IC693CBL300 series shielded cables
- Up to 7 remote baseplates (CPUs 350-364) or 4 baseplates (CPUs 331-341)
- Maintains 700-foot maximum distance to last remote rackUses differential signaling for noise immunity in industrial environments.
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Power Distribution ArchitectureThe baseplate accepts any IC693PWRxxx series power supply (AC or DC input). The power supply connects to the standard power mounting location and distributes:
- 5 VDC logic power to CPU and module electronics across all 5 slots
- 24 VDC field power to I/O modules for field device operationThe mid-depth chassis provides slightly more space around the power supply for wiring compared to standard depth versions.
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Thermal Management FeaturesThe metal chassis acts as a heat sink for module electronics. The mid-depth design creates additional space between module front panels and cabinet doors compared to standard depth versions:
- Improved natural convection airflow around high-power modules
- Reduced thermal coupling between adjacent modules
- Better cable clearance prevents cables from blocking heat dissipation
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Grounding SystemThe metal chassis provides the primary ground reference:
- Integral grounding studs for connection to plant earth
- Isolated field commons to prevent ground loop formation
- Shield termination points for I/O bus and field wiringProper grounding ensures noise immunity and prevents ground potential differences.
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Compatibility and InterchangeabilityThe IC693CHS397M is electrically and mechanically compatible with all Series 90-30 modules and accessories. It can be mixed with other 5-slot or 10-slot baseplates in the same system, though mixing different depth versions requires attention to front panel alignment and cabinet fitment. Module compatibility remains universal—any Series 90-30 module that fits a standard baseplate fits this mid-depth version.
GE IC693CHS391
Field Service Pitfalls: What Rookies Get Wrong
Assuming mid-depth fits all cabinets
You order the IC693CHS397M to replace a standard depth baseplate but don’t verify cabinet depth. The mid-depth unit hits the cabinet door or doesn’t fit in the existing mounting location, forcing cabinet modification or part returns.
- Field Rule: Measure cabinet depth before ordering any baseplate. The IC693CHS397M requires approximately 110mm from mounting surface to door. Add 10mm minimum for door insulation and clearance. If your cabinet is only 120mm deep, this baseplate won’t fit—mid-depth is deeper than standard.
Mixing depth versions without alignment consideration
You install a mid-depth IC693CHS397M alongside standard depth IC693CHS397 baseplates in the same cabinet. The front panels don’t align evenly, creating gaps where dust enters or making door closure difficult.
- Field Rule: If mixing different depth baseplates in the same cabinet, position the deeper units (IC693CHS397M or IC693CHS397L) at the bottom or top. This maintains reasonably even front panel alignment. Use filler panels or spacer kits to cover gaps between different depth units.
Overlooking power supply sizing for mid-depth applications
You fill all 5 slots with high-power modules assuming the mid-depth chassis somehow improves power capacity. Power bus ratings are identical to standard depth versions—you still need to size the supply for total load.
- Field Rule: Mid-depth is a physical dimension only. Electrical capacity doesn’t change. Calculate total module current draw (5V logic + 24V field) and size power supply accordingly. The 10-amp limit for IC690PWR124 applies regardless of chassis depth.
Incorrect cable management planning
You install the mid-depth baseplate using cable management designed for standard depth units. The extra 12mm of depth creates cable slack, messy bundles, or potential snagging on cabinet components.
- Field Rule: Adjust cable management for the increased depth. You may need slightly longer cable ties, repositioned wire ducts, or different routing paths to maintain clean cable organization with the mid-depth chassis. Plan cable paths before final mounting.
Forgetting termination on remote expansion
You expand from the IC693CHS397M to remote baseplates but don’t terminate the I/O bus at the last rack. Signal reflections cause intermittent communication faults that you mistakenly attribute to the new baseplate.
- Field Rule: The mid-depth baseplate doesn’t change electrical requirements. Always terminate the I/O bus at the last remote baseplate using IC693ACC307 or built-in termination cable. Unterminated buses create ghost signals and data corruption regardless of chassis depth.
Improper module insertion due to depth assumption
You assume the extra depth of the IC693CHS397M allows you to insert modules at an angle without precision. Pins bend because the edge connector spacing hasn’t changed—you’re just seeing more clearance at the front panel.
- Field Rule: Module insertion technique is identical regardless of chassis depth. Support the module fully, align with edge connector, and push straight in. The mid-depth chassis provides more working space, but insertion alignment requirements don’t change.
Ignoring thermal differences in sealed cabinets
You install the mid-depth baseplate in a sealed enclosure assuming the extra depth provides adequate cooling for high-power modules. Sealed cabinets still accumulate heat, and the mid-depth design alone won’t prevent overheating.
- Field Rule: The mid-depth design provides marginal thermal benefit compared to standard depth, but sealed cabinets still require forced cooling or ventilation. Don’t assume extra chassis depth replaces proper thermal management. Monitor baseplate temperature during commissioning.
Using incompatible power supplies
You install a VersaMax power supply in the Series 90-30 baseplate because “it fits the mounting holes.” The connector doesn’t match, the pinout is incompatible, and you risk damaging either component.
- Field Rule: IC693CHS397M is Series 90-30 only. Use only IC693PWRxxx series power supplies designed for Series 90-30. Don’t cross families—VersaMax, RX3i, and other GE PLC families have different power requirements and backplane interfaces.
Hot-swapping modules or power supply
You attempt to change modules or the power supply without powering down. Backplane transients damage components or crash the CPU, requiring system reboot and potentially smoked hardware.
- Field Rule: Always kill power before removing modules or power supplies. These aren’t hot-swappable components. Power down, verify zero voltage, then perform your changes. Hot-swapping in Series 90-30 systems eventually results in component damage.
Forgetting grounding on mixed-depth installations
You install a mid-depth baseplate alongside a standard depth unit but only ground one of them. Ground potential differences between the two chassis cause noise issues or erratic I/O behavior.
- Field Rule: Every baseplate, regardless of depth, requires proper grounding. When mixing depth versions, ground each chassis individually to plant earth. Don’t assume one ground serves multiple chassis—ground each unit independently.
Commercial Availability & Pricing Note
Please note: The listed price is for reference only and is not binding. Final pricing and terms are subject to negotiation based on current market conditions and availability.
